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Inicio ProductosTablero híbrido del PWB4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)
4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)
4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB) 4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB) 4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)
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4-Layer Hybrid RO4003C laminate + Dual Tg170 FR4 Prepreg print circuit board (PCB)

Nombre de la marca: Rogers Número de modelo: Se incluyen en la lista de productos de la sección A del presente anexo:

Descripción de producto

This article presents the design rationale for a 4-layer hybrid dielectric PCB that combines the superior high-frequency performance of Rogers RO4003C™ with the cost-effectiveness and thermal reliability of Tg170 FR4 prepreg. This hybrid construction is engineered for RF/microwave applications requiring controlled impedance, low signal attenuation, and reliable thermal performance in a compact, thin form factor. By utilizing RO4003C as the RF signal layer and Tg170 FR4

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