Placa de Circuito Impreso Híbrida de Alta Frecuencia de 8 Capas – RO4003C (Rogers) + S1000-2M (Shengyi) con Vías Ciegas y Vías Rellenas de Resina
Persona de Contacto : Sally Mao
Número de teléfono : 86-755-27374847
WhatsApp : +8618277967574
Descripción de producto
Q: What is this TU-872 SLK PCB solution, and what does it deliver? A: This is a 12-layer, high-performance FR-4–based PCB built with TU-872 SLK laminate and TU-87P SLK prepreg – a modified epoxy system engineered for low dielectric constant (Dk < 4.0) and low dissipation factor (Df < 0.010) , targeting high-speed digital, RF, and telecom applications. The reference product is specified as: 12 layers, 1.68mm finished thickness Outer layers: 1 oz copper | Inner layers: 0.5 oz
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