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Inicio ProductosPCB de RFTP1020 high-Dk 10.2 RF Double-sided copper-clad Laminate and fabricate 2 layer 59mil thickness substrate PCB with Pure Gold
TP1020 high-Dk 10.2 RF Double-sided copper-clad Laminate and fabricate 2 layer 59mil thickness substrate PCB with Pure Gold
TP1020 high-Dk 10.2 RF Double-sided copper-clad Laminate and fabricate 2 layer 59mil thickness substrate PCB with Pure Gold TP1020 high-Dk 10.2 RF Double-sided copper-clad Laminate and fabricate 2 layer 59mil thickness substrate PCB with Pure Gold TP1020 high-Dk 10.2 RF Double-sided copper-clad Laminate and fabricate 2 layer 59mil thickness substrate PCB with Pure Gold
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TP1020 high-Dk 10.2 RF Double-sided copper-clad Laminate and fabricate 2 layer 59mil thickness substrate PCB with Pure Gold

Nombre de la marca: Wangling Número de modelo: TP1020

Descripción de producto

TP1020 is a high-dielectric-constant (high-Dk) laminate from the TP series of high-frequency thermoplastic materials. Unlike glass-reinforced PTFE laminates, TP materials use a ceramic-filled polyphenylene oxide (PPO) dielectric layer without fiberglass reinforcement. By precisely adjusting the ratio of ceramic to PPO resin, the dielectric constant can be tuned over a wide range—from 3 to 25—while maintaining stable electrical performance and low dielectric loss. The TP

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