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Custom Design manufacture 2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish

Custom Design manufacture 2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish

Cuota De Producción: 1 Uds.
Precio: 2.99USD/pcs
Embalaje Estándar: embalaje
Período De Entrega: 2-10 días laborables
Método De Pago: T/T, Paypal
Capacidad De Suministro: 50000PCS
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Rogers
Certificación
ISO9001
Número de modelo
RO3010
Cantidad de orden mínima:
1 Uds.
Precio:
2.99USD/pcs
Detalles de empaquetado:
embalaje
Tiempo de entrega:
2-10 días laborables
Condiciones de pago:
T/T, Paypal
Capacidad de la fuente:
50000PCS
Descripción del producto

2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish

 

 

PCB Introduction

As a trusted supplier of advanced high-frequency circuit solutions, we are proud to present our Custom 2-Layer RO3010 PCB. Engineered for demanding RF and microwave applications, this board utilizes Rogers RO3010—a ceramic-filled PTFE composite known for its high dielectric constant (10.2) and exceptional signal stability. With a finished thickness of 50mil (1.3mm) and an Electroless Palladium Immersion Gold (EPIG, nickel-free) finish, this PCB delivers low loss, superior solderability, and reliable performance in extreme environments (-40°C to +85°C).

 

Custom Design manufacture 2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish 0

 

Key Specifications

Parameter Details
Base Material Rogers RO3010 (Ceramic-filled PTFE)
Layer Count 2 Layers (Double-sided)
Finished Thickness 1.3mm (50mil)
Copper Weight 1 oz (35μm) on both outer layers
Min Trace/Space 5/6 mils
Min Hole Size 0.25mm (Mechanical drilling)
Via Plating Thickness 20 μm
Surface Finish EPIG (Nickel-free) – Ideal for high-frequency and fine-pitch components
Silkscreen Top: Black / Bottom: None
Solder Mask None (Bare copper with EPIG on pads)
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Accepted Standard IPC-Class-2

 

 

PCB Stackup (2-Layer Rigid)

Layer Material Thickness
Top Copper 1 oz (35 μm) 0.0014"
Substrate Rogers RO3010 1.27 mm (50mil)
Bottom Copper 1 oz (35 μm) 0.0014"

 

 

Board Statistics

 

Dimensions: 89.65mm × 94.3mm (1 piece)

Components: 21

Total Pads: 45 (31 thru-hole, 14 SMT on top, 0 on bottom)

Vias: 29 (No blind vias)

Nets: 2 (Simple, high-power or high-frequency signal path)

 

 

Why RO3010?

Rogers RO3010 is a high-Dk (10.2 ±0.30 @ 10 GHz) material with a low dissipation factor of 0.0022, ensuring minimal signal loss. Its thermal conductivity (0.95 W/mK) and matched coefficient of thermal expansion (CTE) to copper provide excellent dimensional stability across a wide temperature range (-55°C to 288°C). With Td >500°C and moisture absorption of just 0.05%, it outperforms standard FR4 in harsh RF environments.

 

 

Key Benefits

 

Signal Integrity: High Dk enables circuit miniaturization without compromising performance.

 

Cost-Effective: Economical pricing for volume manufacturing, ideal for commercial RF designs.

 

Reliable: ISO 9001 certified production with 100% electrical testing.

 

EPIG Advantage: Nickel-free surface finish eliminates magnetic interference, perfect for RF and high-speed digital applications.

 

Global Availability: Shipped worldwide with full IPC-Class-2 compliance.

 

 

 

Typical Applications

 

Automotive radar (24 GHz / 77 GHz)

 

Global positioning satellite (GPS) antennas

 

Cellular base station power amplifiers & antennas

 

Patch antennas for wireless communications

 

Direct broadcast satellites (DBS)

 

RF data link systems

 

Remote meter readers

 

High-frequency power backplanes

 

 

 

Ordering & Support

We offer complete design-to-delivery support. Supply your Gerber RS-274-X files, and we will deliver fully tested, RO3010-based PCBs with EPIG finish. Contact us for prototype or volume pricing.

 

productos
DETALLES DE LOS PRODUCTOS
Custom Design manufacture 2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish
Cuota De Producción: 1 Uds.
Precio: 2.99USD/pcs
Embalaje Estándar: embalaje
Período De Entrega: 2-10 días laborables
Método De Pago: T/T, Paypal
Capacidad De Suministro: 50000PCS
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Rogers
Certificación
ISO9001
Número de modelo
RO3010
Cantidad de orden mínima:
1 Uds.
Precio:
2.99USD/pcs
Detalles de empaquetado:
embalaje
Tiempo de entrega:
2-10 días laborables
Condiciones de pago:
T/T, Paypal
Capacidad de la fuente:
50000PCS
Descripción del producto

2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish

 

 

PCB Introduction

As a trusted supplier of advanced high-frequency circuit solutions, we are proud to present our Custom 2-Layer RO3010 PCB. Engineered for demanding RF and microwave applications, this board utilizes Rogers RO3010—a ceramic-filled PTFE composite known for its high dielectric constant (10.2) and exceptional signal stability. With a finished thickness of 50mil (1.3mm) and an Electroless Palladium Immersion Gold (EPIG, nickel-free) finish, this PCB delivers low loss, superior solderability, and reliable performance in extreme environments (-40°C to +85°C).

 

Custom Design manufacture 2-Layer RO3010 High-Frequency PCB (50mil / 1.3mm) – EPIG Finish 0

 

Key Specifications

Parameter Details
Base Material Rogers RO3010 (Ceramic-filled PTFE)
Layer Count 2 Layers (Double-sided)
Finished Thickness 1.3mm (50mil)
Copper Weight 1 oz (35μm) on both outer layers
Min Trace/Space 5/6 mils
Min Hole Size 0.25mm (Mechanical drilling)
Via Plating Thickness 20 μm
Surface Finish EPIG (Nickel-free) – Ideal for high-frequency and fine-pitch components
Silkscreen Top: Black / Bottom: None
Solder Mask None (Bare copper with EPIG on pads)
Electrical Test 100% prior to shipment
Artwork Format Gerber RS-274-X
Accepted Standard IPC-Class-2

 

 

PCB Stackup (2-Layer Rigid)

Layer Material Thickness
Top Copper 1 oz (35 μm) 0.0014"
Substrate Rogers RO3010 1.27 mm (50mil)
Bottom Copper 1 oz (35 μm) 0.0014"

 

 

Board Statistics

 

Dimensions: 89.65mm × 94.3mm (1 piece)

Components: 21

Total Pads: 45 (31 thru-hole, 14 SMT on top, 0 on bottom)

Vias: 29 (No blind vias)

Nets: 2 (Simple, high-power or high-frequency signal path)

 

 

Why RO3010?

Rogers RO3010 is a high-Dk (10.2 ±0.30 @ 10 GHz) material with a low dissipation factor of 0.0022, ensuring minimal signal loss. Its thermal conductivity (0.95 W/mK) and matched coefficient of thermal expansion (CTE) to copper provide excellent dimensional stability across a wide temperature range (-55°C to 288°C). With Td >500°C and moisture absorption of just 0.05%, it outperforms standard FR4 in harsh RF environments.

 

 

Key Benefits

 

Signal Integrity: High Dk enables circuit miniaturization without compromising performance.

 

Cost-Effective: Economical pricing for volume manufacturing, ideal for commercial RF designs.

 

Reliable: ISO 9001 certified production with 100% electrical testing.

 

EPIG Advantage: Nickel-free surface finish eliminates magnetic interference, perfect for RF and high-speed digital applications.

 

Global Availability: Shipped worldwide with full IPC-Class-2 compliance.

 

 

 

Typical Applications

 

Automotive radar (24 GHz / 77 GHz)

 

Global positioning satellite (GPS) antennas

 

Cellular base station power amplifiers & antennas

 

Patch antennas for wireless communications

 

Direct broadcast satellites (DBS)

 

RF data link systems

 

Remote meter readers

 

High-frequency power backplanes

 

 

 

Ordering & Support

We offer complete design-to-delivery support. Supply your Gerber RS-274-X files, and we will deliver fully tested, RO3010-based PCBs with EPIG finish. Contact us for prototype or volume pricing.

 

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