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F4BTM350 2-layer PCB 3.048mm 120mil substrate core laminate 35um copper weight using in Microwave and RF Systems

F4BTM350 2-layer PCB 3.048mm 120mil substrate core laminate 35um copper weight using in Microwave and RF Systems

Cuota De Producción: 1 Uds.
Precio: 0.99USD/PCS
Embalaje Estándar: Embalaje
Período De Entrega: 2-10 días hábiles
Método De Pago: T/t, PayPal
Capacidad De Suministro: 50000 piezas
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Wangling
Certificación
ISO9001
Número de modelo
F4BTM350
Cantidad de orden mínima:
1 Uds.
Precio:
0.99USD/PCS
Detalles de empaquetado:
Embalaje
Tiempo de entrega:
2-10 días hábiles
Condiciones de pago:
T/t, PayPal
Capacidad de la fuente:
50000 piezas
Descripción del producto

F4BTM350 PCB 2-layer 3.048mm 120mil Thick
 
We are excited to present our 2-layer PCB, built with F4BTM350 laminate, a material engineered for demanding microwave, RF, and radar system applications. This PCB combines high dielectric constant, low loss, and excellent thermal conductivity, making it ideal for high-frequency designs. Below is a detailed breakdown of its construction, features, and applications.
 
F4BTM350 2-layer PCB 3.048mm 120mil substrate core laminate 35um copper weight using in Microwave and RF Systems 0
 
PCB Construction Details

ParameterSpecification
Base MaterialF4BTM350
Layer Count2-layer
Board Dimensions328mm x 84.08mm ± 0.15mm
Minimum Trace/Space5/7 mils
Minimum Hole Size0.4mm
Blind/Buried ViasNone
Finished Board Thickness3.1mm
Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20μm
Surface FinishImmersion Gold
Top Solder MaskBlack
Bottom Solder MaskNone
Top SilkscreenWhite
Bottom SilkscreenNone
Electrical Testing100% tested prior to shipment
Quality StandardIPC-Class-2

 
 
PCB Stackup
The F4BTM350 core, with its 3.048mm thickness (120mil), ensures low loss and high thermal stability, making it suitable for high-frequency applications. The stackup includes:

LayerMaterialThickness
Copper Layer 1Copper Foil35μm
Core MaterialF4BTM350 Core3.048mm
Copper Layer 2Copper Foil35μm

 
 
PCB Statistics
This PCB is designed for compact, high-performance designs with the following specifications:

ParameterValue
Components58
Total Pads139
Thru Hole Pads97
Top SMT Pads42
Bottom SMT Pads0
Vias68
Nets2
Supplied ArtworkGerber RS-274-X

 
 
About F4BTM350 Material
The F4BTM350 laminate, developed by Wangling, is a high-performance material made from fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene (PTFE) resin. This advanced formulation delivers superior dielectric properties, low loss, and thermal stability, making it ideal for high-frequency applications in telecommunications, aerospace, and defense.
 
Key Features of F4BTM350:

  • Dielectric Constant (Dk): 3.5 ± 0.07 at 10GHz, ensuring precise impedance control.
  • Dissipation Factor (Df): 0.0025 at 10GHz, enabling minimal signal loss.
  • Thermal Coefficient of Dk: -60 ppm/°C (from -55°C to 150°C), ensuring stability across temperature ranges.
  • Coefficient of Thermal Expansion (CTE): X-axis: 10 ppm/°C. Y-axis: 12 ppm/°C. Z-axis: 51 ppm/°C.
  • Moisture Absorption: ≤ 0.05%, providing reliable performance in humid environments.
  • Thermal Conductivity: Enhanced due to nano-ceramic filling, ensuring efficient heat dissipation.
  • Flammability: UL-94 V0 rated for safety.
  • Comparative Tracking Index (CTI): >600V, Grade 0.

 
 
Applications

  1. Microwave and RF Systems 
  2. Phase Shifters 
  3. Power Dividers, Couplers, and Combiners 
  4. Feed Networks 
  5. Phase-Sensitive Antennas and Phased-Array Antennas 
  6. Satellite Communications 
  7. Base Station Antennas 

 
 
Conclusion
The 2-layer PCB with F4BTM350 core is a robust and cost-efficient solution for high-frequency applications. Its combination of low loss, thermal stability, and excellent mechanical properties makes it an ideal choice for industries such as telecommunications, aerospace, and defense.
 
For more information or to request a quote, contact us today. We are committed to delivering high-quality PCBs that meet the most demanding requirements of your applications!
 

productos
DETALLES DE LOS PRODUCTOS
F4BTM350 2-layer PCB 3.048mm 120mil substrate core laminate 35um copper weight using in Microwave and RF Systems
Cuota De Producción: 1 Uds.
Precio: 0.99USD/PCS
Embalaje Estándar: Embalaje
Período De Entrega: 2-10 días hábiles
Método De Pago: T/t, PayPal
Capacidad De Suministro: 50000 piezas
Información detallada
Lugar de origen
Porcelana
Nombre de la marca
Wangling
Certificación
ISO9001
Número de modelo
F4BTM350
Cantidad de orden mínima:
1 Uds.
Precio:
0.99USD/PCS
Detalles de empaquetado:
Embalaje
Tiempo de entrega:
2-10 días hábiles
Condiciones de pago:
T/t, PayPal
Capacidad de la fuente:
50000 piezas
Descripción del producto

F4BTM350 PCB 2-layer 3.048mm 120mil Thick
 
We are excited to present our 2-layer PCB, built with F4BTM350 laminate, a material engineered for demanding microwave, RF, and radar system applications. This PCB combines high dielectric constant, low loss, and excellent thermal conductivity, making it ideal for high-frequency designs. Below is a detailed breakdown of its construction, features, and applications.
 
F4BTM350 2-layer PCB 3.048mm 120mil substrate core laminate 35um copper weight using in Microwave and RF Systems 0
 
PCB Construction Details

ParameterSpecification
Base MaterialF4BTM350
Layer Count2-layer
Board Dimensions328mm x 84.08mm ± 0.15mm
Minimum Trace/Space5/7 mils
Minimum Hole Size0.4mm
Blind/Buried ViasNone
Finished Board Thickness3.1mm
Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20μm
Surface FinishImmersion Gold
Top Solder MaskBlack
Bottom Solder MaskNone
Top SilkscreenWhite
Bottom SilkscreenNone
Electrical Testing100% tested prior to shipment
Quality StandardIPC-Class-2

 
 
PCB Stackup
The F4BTM350 core, with its 3.048mm thickness (120mil), ensures low loss and high thermal stability, making it suitable for high-frequency applications. The stackup includes:

LayerMaterialThickness
Copper Layer 1Copper Foil35μm
Core MaterialF4BTM350 Core3.048mm
Copper Layer 2Copper Foil35μm

 
 
PCB Statistics
This PCB is designed for compact, high-performance designs with the following specifications:

ParameterValue
Components58
Total Pads139
Thru Hole Pads97
Top SMT Pads42
Bottom SMT Pads0
Vias68
Nets2
Supplied ArtworkGerber RS-274-X

 
 
About F4BTM350 Material
The F4BTM350 laminate, developed by Wangling, is a high-performance material made from fiberglass cloth, nano-ceramic filling, and polytetrafluoroethylene (PTFE) resin. This advanced formulation delivers superior dielectric properties, low loss, and thermal stability, making it ideal for high-frequency applications in telecommunications, aerospace, and defense.
 
Key Features of F4BTM350:

  • Dielectric Constant (Dk): 3.5 ± 0.07 at 10GHz, ensuring precise impedance control.
  • Dissipation Factor (Df): 0.0025 at 10GHz, enabling minimal signal loss.
  • Thermal Coefficient of Dk: -60 ppm/°C (from -55°C to 150°C), ensuring stability across temperature ranges.
  • Coefficient of Thermal Expansion (CTE): X-axis: 10 ppm/°C. Y-axis: 12 ppm/°C. Z-axis: 51 ppm/°C.
  • Moisture Absorption: ≤ 0.05%, providing reliable performance in humid environments.
  • Thermal Conductivity: Enhanced due to nano-ceramic filling, ensuring efficient heat dissipation.
  • Flammability: UL-94 V0 rated for safety.
  • Comparative Tracking Index (CTI): >600V, Grade 0.

 
 
Applications

  1. Microwave and RF Systems 
  2. Phase Shifters 
  3. Power Dividers, Couplers, and Combiners 
  4. Feed Networks 
  5. Phase-Sensitive Antennas and Phased-Array Antennas 
  6. Satellite Communications 
  7. Base Station Antennas 

 
 
Conclusion
The 2-layer PCB with F4BTM350 core is a robust and cost-efficient solution for high-frequency applications. Its combination of low loss, thermal stability, and excellent mechanical properties makes it an ideal choice for industries such as telecommunications, aerospace, and defense.
 
For more information or to request a quote, contact us today. We are committed to delivering high-quality PCBs that meet the most demanding requirements of your applications!
 

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