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RF-10 high frequency material PCB 2-Layer Copper Clad Laminate 10mil Core with ENIG Finish using in Microstrip Patch Antennas

RF-10 high frequency material PCB 2-Layer Copper Clad Laminate 10mil Core with ENIG Finish using in Microstrip Patch Antennas

Cuota De Producción: 1 por ciento
Precio: 0.99-99USD/PCS
Embalaje Estándar: Embalaje
Período De Entrega: 2-10 días hábiles
Método De Pago: T/t, PayPal
Capacidad De Suministro: 50000pcs
Información detallada
Lugar de origen
PORCELANA
Nombre de la marca
Taconic
Certificación
ISO9001
Número de modelo
RF-10
Cantidad de orden mínima:
1 por ciento
Precio:
0.99-99USD/PCS
Detalles de empaquetado:
Embalaje
Tiempo de entrega:
2-10 días hábiles
Condiciones de pago:
T/t, PayPal
Capacidad de la fuente:
50000pcs
Descripción del producto

RF-10 PCB: 2-Layer, 10mil Core, Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 

 
Overview of the 2-Layer RF-10 PCB
The 2-layer RF-10 PCB is a high-performance, ceramic-filled PTFE laminate designed for RF and microwave applications requiring high dielectric constant (Dk), low insertion loss, and outstanding dimensional stability. With its 10mil (0.254mm) core, immersion gold (ENIG) surface finish, and precise construction, this PCB supports miniaturized designs for high-frequency applications like microstrip patch antennas, GPS systems, and satellite components.
 
RF-10 high frequency material PCB 2-Layer Copper Clad Laminate 10mil Core with ENIG Finish using in Microstrip Patch Antennas 0
 
PCB Construction Details

ParameterSpecification
Base MaterialRF-10
Layer Count2 layers
Board Dimensions45mm x 50mm ± 0.15mm
Minimum Trace/Space6/5 mils
Minimum Hole Size0.3mm
Blind ViasNo
Finished Board Thickness0.3mm
Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Gold (ENIG)
Top SilkscreenNone
Bottom SilkscreenNone
Top Solder MaskNone
Bottom Solder MaskNone
Electrical Testing100% tested prior to shipment

 
 
PCB Stackup

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRF-10 Ceramic PTFE10mil (0.254mm)
Copper Layer 2Copper (1oz)35 μm

 
 
PCB Statistics
The compact 2-layer RF-10 PCB is designed for simplified but reliable layouts. Below are the key statistics:

  • Components: 7
  • Total Pads: 29
  • Thru Hole Pads: 21
  • Top SMT Pads: 8
  • Bottom SMT Pads: 0
  • Vias: 14
  • Nets: 2

 
 
Introduction to RF-10 Material
RF-10 laminates are composites of ceramic-filled PTFE reinforced with woven fiberglass. These materials are engineered to deliver high dielectric constant, low dissipation factor, and excellent dimensional stability.
 
Key attributes include:

  1. High thermal conductivity: Efficient heat dissipation for thermal management.
  2. Low dissipation factor: Minimizes signal loss at high frequencies.
  3. Tight Dk tolerance: Ensures consistent performance across applications.

 
 
Features of RF-10

  • Dielectric Constant (Dk): 10.2 ± 0.3 at 10GHz
  • Dissipation Factor (Df): 0.0025 at 10GHz
  • Thermal Conductivity: 0.85 W/mK (unclad)
  • Coefficient of Thermal Expansion (CTE): X-axis: 16 ppm/°C, Y-axis: 20 ppm/°C, Z-axis: 25 ppm/°C
  • Moisture Absorption: 0.08%
  • Flammability Rating: UL-94 V0

 
 
Benefits of RF-10 PCB

  • High Dielectric Constant (Dk): Enables size reduction for RF circuits.
  • Low Dissipation Factor: Minimizes phase shift and insertion loss.
  • High Thermal Conductivity: Improves heat dissipation for better performance.
  • Excellent Dimensional Stability: Ensures high production yields and reliability.
  • Smooth Copper Bonding: Reduces skin-effect losses at high frequencies.
  • Low Moisture Absorption: Maintains performance in humid environments.
  • Cost-Effective: Delivers excellent performance at a competitive price.

 
 
 
Applications of RF-10 PCB

  • Microstrip Patch Antennas
  • GPS Antennas
  • Passive Components:
  • Aircraft Collision Avoidance Systems
  • Satellite Components

 
 
Why Choose the 2-Layer RF-10 PCB?
The 2-layer RF-10 PCB is a reliable solution for high-frequency circuit designs requiring low loss, compact size, and thermal stability. Its 10mil core, ENIG finish, and high Dk make it an ideal choice for aerospace, telecommunications, and satellite systems.
 
Contact us today to learn more about this high-performance PCB or to place your order!
 
RF-10 high frequency material PCB 2-Layer Copper Clad Laminate 10mil Core with ENIG Finish using in Microstrip Patch Antennas 1
 

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DETALLES DE LOS PRODUCTOS
RF-10 high frequency material PCB 2-Layer Copper Clad Laminate 10mil Core with ENIG Finish using in Microstrip Patch Antennas
Cuota De Producción: 1 por ciento
Precio: 0.99-99USD/PCS
Embalaje Estándar: Embalaje
Período De Entrega: 2-10 días hábiles
Método De Pago: T/t, PayPal
Capacidad De Suministro: 50000pcs
Información detallada
Lugar de origen
PORCELANA
Nombre de la marca
Taconic
Certificación
ISO9001
Número de modelo
RF-10
Cantidad de orden mínima:
1 por ciento
Precio:
0.99-99USD/PCS
Detalles de empaquetado:
Embalaje
Tiempo de entrega:
2-10 días hábiles
Condiciones de pago:
T/t, PayPal
Capacidad de la fuente:
50000pcs
Descripción del producto

RF-10 PCB: 2-Layer, 10mil Core, Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)

 

 
Overview of the 2-Layer RF-10 PCB
The 2-layer RF-10 PCB is a high-performance, ceramic-filled PTFE laminate designed for RF and microwave applications requiring high dielectric constant (Dk), low insertion loss, and outstanding dimensional stability. With its 10mil (0.254mm) core, immersion gold (ENIG) surface finish, and precise construction, this PCB supports miniaturized designs for high-frequency applications like microstrip patch antennas, GPS systems, and satellite components.
 
RF-10 high frequency material PCB 2-Layer Copper Clad Laminate 10mil Core with ENIG Finish using in Microstrip Patch Antennas 0
 
PCB Construction Details

ParameterSpecification
Base MaterialRF-10
Layer Count2 layers
Board Dimensions45mm x 50mm ± 0.15mm
Minimum Trace/Space6/5 mils
Minimum Hole Size0.3mm
Blind ViasNo
Finished Board Thickness0.3mm
Copper Weight1oz (1.4 mils) outer layers
Via Plating Thickness20 μm
Surface FinishImmersion Gold (ENIG)
Top SilkscreenNone
Bottom SilkscreenNone
Top Solder MaskNone
Bottom Solder MaskNone
Electrical Testing100% tested prior to shipment

 
 
PCB Stackup

LayerMaterialThickness
Copper Layer 1Copper (1oz)35 μm
Core MaterialRF-10 Ceramic PTFE10mil (0.254mm)
Copper Layer 2Copper (1oz)35 μm

 
 
PCB Statistics
The compact 2-layer RF-10 PCB is designed for simplified but reliable layouts. Below are the key statistics:

  • Components: 7
  • Total Pads: 29
  • Thru Hole Pads: 21
  • Top SMT Pads: 8
  • Bottom SMT Pads: 0
  • Vias: 14
  • Nets: 2

 
 
Introduction to RF-10 Material
RF-10 laminates are composites of ceramic-filled PTFE reinforced with woven fiberglass. These materials are engineered to deliver high dielectric constant, low dissipation factor, and excellent dimensional stability.
 
Key attributes include:

  1. High thermal conductivity: Efficient heat dissipation for thermal management.
  2. Low dissipation factor: Minimizes signal loss at high frequencies.
  3. Tight Dk tolerance: Ensures consistent performance across applications.

 
 
Features of RF-10

  • Dielectric Constant (Dk): 10.2 ± 0.3 at 10GHz
  • Dissipation Factor (Df): 0.0025 at 10GHz
  • Thermal Conductivity: 0.85 W/mK (unclad)
  • Coefficient of Thermal Expansion (CTE): X-axis: 16 ppm/°C, Y-axis: 20 ppm/°C, Z-axis: 25 ppm/°C
  • Moisture Absorption: 0.08%
  • Flammability Rating: UL-94 V0

 
 
Benefits of RF-10 PCB

  • High Dielectric Constant (Dk): Enables size reduction for RF circuits.
  • Low Dissipation Factor: Minimizes phase shift and insertion loss.
  • High Thermal Conductivity: Improves heat dissipation for better performance.
  • Excellent Dimensional Stability: Ensures high production yields and reliability.
  • Smooth Copper Bonding: Reduces skin-effect losses at high frequencies.
  • Low Moisture Absorption: Maintains performance in humid environments.
  • Cost-Effective: Delivers excellent performance at a competitive price.

 
 
 
Applications of RF-10 PCB

  • Microstrip Patch Antennas
  • GPS Antennas
  • Passive Components:
  • Aircraft Collision Avoidance Systems
  • Satellite Components

 
 
Why Choose the 2-Layer RF-10 PCB?
The 2-layer RF-10 PCB is a reliable solution for high-frequency circuit designs requiring low loss, compact size, and thermal stability. Its 10mil core, ENIG finish, and high Dk make it an ideal choice for aerospace, telecommunications, and satellite systems.
 
Contact us today to learn more about this high-performance PCB or to place your order!
 
RF-10 high frequency material PCB 2-Layer Copper Clad Laminate 10mil Core with ENIG Finish using in Microstrip Patch Antennas 1
 

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