F4BTMS220 PCB 2-Layer base on 5mil Core laminates 0.2mm Thickness with Black Solder Mask and Gold Finish using in Feed networks

F4BTMS220 PCB: 2-Layer, 5mil Core, 0.2mm Thickness, Black Solder Mask with Immersion Gold Finish

(All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.)
 

Overview of F4BTMS220 2-Layer PCB

The F4BTMS220 PCB is a 2-layer rigid PCB designed for high-frequency, aerospace, and RF applications. Built with F4BTMS220 laminates, this PCB offers a 5mil core and a finished thickness of 0.2mm, delivering exceptional dimensional stability, low dielectric loss, and enhanced thermal conductivity. The black solder mask, combined with a white silkscreen on the top layer, provides a clean, professional finish, while the immersion gold surface finish ensures superior solderability and corrosion resistance.

With a dielectric constant (Dk) of 2.2 ± 0.02 at 10 GHz and dissipation factor as low as 0.0009, the F4BTMS220 PCB is an ideal choice for microwave, radar, and satellite communication systems.

PCB Construction Details

PCB Stackup

Introduction to F4BTMS220 Material

The F4BTMS220 laminate is a technologically advanced material designed for high-reliability applications. It features a unique combination of nano-ceramics, PTFE resin, and ultra-thin glass fiber cloth, which minimizes dielectric loss and improves dimensional stability. The material's low anisotropy and enhanced thermal conductivity make it an excellent choice for microwave and RF circuits.

Key Features of F4BTMS220

• Dielectric Constant (Dk): 2.2 ± 0.02 at 10 GHz.
• Dissipation Factor: 0.0009 at 10 GHz, 0.001 at 20 GHz.
• Thermal Coefficient of Dk: -130 ppm/°C over a range of -55°C to 150°C.
• CTE (Coefficient of Thermal Expansion): X-axis: 40 ppm/°C. Y-axis: 50 ppm/°C. Z-axis: 290 ppm/°C.
• Moisture Absorption: Extremely low at 0.02%.
• UL-94 V0 Certified: Meets stringent flammability standards.

Benefits of F4BTMS220

• Exceptional Electrical Stability: Supports a wide frequency range with minimal dielectric loss.
• High Thermal Conductivity: Enhances heat dissipation for high-power applications.
• Improved Dimensional Stability: Ensures reliability in extreme environments.
• Low Conductor Loss: Achieved with RTF low roughness copper foil.

Applications

Aerospace Equipment

Microwave and RF Circuits

Military Radar Systems

Feed Networks

Phased Array Antennas

Satellite Communications

Conclusion

The F4BTMS220 2-layer PCB is a top-tier solution for aerospace, RF, and microwave applications, offering low dielectric loss, thermal stability, and dimensional accuracy. With its 5mil core, black solder mask, and immersion gold finish, this PCB delivers high reliability and exceptional performance for critical systems such as radar arrays, satellite communications, and phased antennas.

Compliant with IPC-Class-2 standards and available worldwide, the F4BTMS220 PCB is the perfect choice for engineers seeking cutting-edge, high-frequency PCB solutions.