2-Layer RF-10 PCB 10mil Core ceramic-filled PTFE laminate with ENEPIG Finish for high-frequency RF applications

2-Layer RF-10 PCB | 10mil Core | ENEPIG Finish

Product Overview

We are pleased to present this newly customized 2-layer rigid PCB engineered specifically for high-frequency RF applications. Built on RF-10 ceramic-filled PTFE laminate, this board offers a stable dielectric constant (DK=10.2) and an ultra-low dissipation factor (0.0025 at 10GHz), enabling significant circuit size reduction while maintaining signal integrity. The board measures 143.6mm x 109.8mm (supplied as two types, two pieces total) with a finished thickness of 0.5mm and dimensional tolerance of ±0.15mm.

A key feature of this design is the absence of solder mask and silkscreen on both sides. This intentional choice eliminates parasitic capacitance and signal degradation, which is critical for high-frequency performance. The ENEPIG surface finish provides excellent solderability, corrosion resistance, and supports fine-pitch soldering as well as aluminum wire bonding. Every board undergoes 100% electrical testing prior to shipment and conforms to IPC-Class-2 quality standards. Gerber files are supplied in RS-274-X format, and worldwide shipping is available.

PCB General Specifications

Material Advantages

The RF-10 copper-clad laminate is a composite of ceramic-filled PTFE and woven fiberglass. This material combines a high dielectric constant with low dissipation factor, making it particularly suitable for RF applications requiring size reduction. The thin woven fiberglass reinforcement provides rigidity for ease of handling and excellent dimensional stability for multilayer circuits. RF-10 bonds well to smooth, low-profile copper, and its low dissipation factor—combined with very smooth copper—results in optimal insertion loss performance at higher frequencies where skin effect losses play a substantial role.

Key material benefits include high DK for circuit miniaturization, tight DK tolerance (±0.3), high thermal conductivity (0.85 W/m·K) for enhanced thermal management, low CTE in all axes (x:16, y:20, z:25 ppm/°C), low moisture absorption (0.08%), and V-0 flammability rating. This construction offers an excellent price/performance ratio with industry-acceptable delivery times.

RF-10 Material Properties (at 10 GHz)

PCB Stackup & Construction

The board features a straightforward yet robust 2-layer stackup: 1oz copper (35μm) – RF-10 core (10 mils / 0.254mm) – 1oz copper (35μm). Minimum trace and space are 5/7 mils, with a minimum finished hole size of 0.4mm. Via plating thickness is 20μm, and no blind vias are used. This construction is designed for reliable thru-hole and surface-mount assembly, supporting 24 components, 51 total pads (34 thru-hole, 17 top SMT), and 29 vias across 2 nets.

Typical Applications

Microstrip patch antennas and GPS antennas

Passive components such as filters, couplers, and power dividers

Aircraft collision avoidance systems

Satellite communication modules

Other high-frequency aerospace and defense assemblies

All PCBs are 100% electrically tested and shipped with a Certificate of Conformance per IPC-6012. For Gerber review, stackup confirmation, or volume pricing, please contact our technical sales team.