| Cuota De Producción: | 1 Uds. |
| Precio: | 7.99 USD/PCS |
| Embalaje Estándar: | Embalaje |
| Período De Entrega: | 2-10 días hábiles |
| Método De Pago: | T/t, PayPal |
| Capacidad De Suministro: | 50000 piezas |
RT/duroid® 5870 Copper-Clad Laminate: Precision and Performance for Demanding High-Frequency Designs
As your trusted supplier, we are pleased to offer the exceptional RT/duroid® 5870, a premier high-frequency laminate from Rogers Corporation engineered for the most critical RF and microwave applications. This material represents the gold standard for designers who require a perfect balance of stable electrical properties, mechanical integrity, and superior processability in stripline and microstrip circuits.
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Unmatched Electrical Consistency and Low Loss
The core advantage of RT/duroid 5870 lies in its construction. It is a glass microfiber-reinforced PTFE composite, where the randomly oriented microfibers create exceptional uniformity in the dielectric constant (Dk) across the entire panel. This results in highly predictable performance, batch after batch. The laminate features a stable dielectric constant of 2.33 ± 0.02 (at 10 GHz) and an exceptionally low dissipation factor (Df) of 0.0012 at the same frequency. This ultra-low loss characteristic ensures minimal signal attenuation, making it an ideal choice for sensitive, high-performance applications operating well into the Ku-band and beyond. Its thermal coefficient of Dk is a remarkably low -115 ppm/°C, guaranteeing stable electrical behavior across a wide operational temperature range (-50°C to +150°C).
| PROPERTY | TYPICAL VALUES | DIRECTION | UNITS[3] | CONDITION | TEST METHOD | |||
| RT/duroid 5870 | RT/duroid 5880 | |||||||
| [1]Dielectric Constant, εr Process | 2.33 2.33 ± 0.02 spec. |
2.2 2.20 ± 0.02 spec. |
Z Z |
N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
||
| [4]Dielectric Constant, εr Design | 2.33 | 2.2 | Z | N/A | 8 GHz - 40 GHz | Differential Phase Length Method |
||
| Dissipation Factor, tan δ | 0.0005 0.0012 |
0.0004 0.0009 |
Z Z |
N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650, 2.5.5.3 10 GHz IPC-TM-2.5.5.5 | ||
| Thermal Coefficient of εr | -115 | -125 | Z | ppm/°C | -50 - 150°C | IPC-TM-650, 2.5.5.5 | ||
| Volume Resistivity | 2 X 107 | 2 X 107 | Z | Mohm cm | C96/35/90 | ASTM D257 | ||
| Surface Resistivity | 2 X 107 | 3 X 107 | Z | Mohm | C/96/35/90 | ASTM D257 | ||
| Specific Heat | 0.96 (0.23) | 0.96 (0.23) | N/A | J/g/K (cal/g/C) |
N/A | Calculated | ||
| Test at 23 °C | Test at 100°C | Test at 23 °C | Test at 100°C | N/A | MPa (kpsi) | A | ASTM D638 | |
| Tensile Modulus | ||||||||
| 1300 (189) | 490 (71) | 1070 (156) | 450 (65) | X | ||||
| 1280 (185) | 430 (63) | 860 (125) | 380 (55) | Y | ||||
| ultimate stress | 50 (7.3) | 34 (4.8) | 29 (4.2) | 20 (2.9) | X | |||
| 42 (6.1) | 34 (4.8) | 27 (3.9) | 18 (2.6) | Y | ||||
| ultimate strain | 9.8 | 8.7 | 6.0 | 7.2 | X | % | ||
| 9.8 | 8.6 | 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 1210 (176) | 680 (99) | 710 (103) | 500 (73) | X | MPa (kpsi) | A | ASTM D695 |
| 1360 (198) | 860 (125) | 710 (103) | 500 (73) | Y | ||||
| 803 (120) | 520 (76) | 940 (136) | 670 (97) | Z | ||||
| ultimate stress | 30 (4.4) | 23 (3.4) | 27 (3.9) | 22 (3.2) | X | |||
| 37 (5.3) | 25 (3.7) | 29 (5.3) | 21 (3.1) | Y | ||||
| 54 (7.8) | 37 (5.3) | 52 (7.5) | 43 (6.3) | Z | ||||
| ultimate strain | 4.0 | 4.3 | 8.5 | 8.4 | X | % | ||
| 3.3 | 3.3 | 7.7 | 7.8 | Y | ||||
| 8.7 | 8.5 | 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | 0.02 | N/A | % | .062” (1.6mm) | ASTM D570 | ||
| D48/50 | ||||||||
| Thermal Conductivity | 0.22 | 0.2 | Z | W/m/K | 80°C | ASTM C518 | ||
| Coefficient of Thermal Expansion |
22 | 31 | X | ppm/°C | 0-100°C | IPC-TM-650, 2.4.41 | ||
| 28 | 48 | Y | ||||||
| 173 | 237 | Z | ||||||
| Td | 500 | 500 | N/A | °CTGA | N/A | ASTM D3850 | ||
| Density | 2.2 | 2.2 | N/A | gm/cm3 | N/A | ASTM D792 | ||
| Copper Peel | 27.2 (4.8) | 31.2 (5.5) | N/A | pli (N/mm) | 1 oz (35mm) EDC | IPC-TM-650 2.4.8 | ||
| foil | ||||||||
| after solder float | ||||||||
| Flammability | V-0 | V-0 | N/A | N/A | N/A | UL94 | ||
| Lead-Free Process Compatible | Yes | Yes | N/A | N/A | N/A | N/A | ||
Robust Mechanical Properties for Reliable Fabrication
Beyond its electrical excellence, RT/duroid 5870 is designed for reliable manufacturing. It is easily machined, cut, and sheared without fraying, and exhibits excellent resistance to the solvents and reagents used in standard PCB etching and plating processes. With a very low moisture absorption of only 0.02%, it maintains dimensional and electrical stability in humid environments. The material provides strong copper peel strength (>4.8 pli for 1 oz EDC) for reliable plated through-holes and surface mounts, and it carries a UL 94 V-0 flammability rating, meeting stringent safety requirements. It is fully compatible with lead-free assembly processes.
Flexible Standard Configurations to Meet Your Needs
We supply RT/duroid 5870 in a variety of standard configurations for your design flexibility:
Standard Thicknesses: 0.005" (0.127mm), 0.010" (0.252mm), 0.020" (0.508mm), 0.031" (0.787mm), and 0.062" (1.575mm), all with tight tolerances. Numerous additional thicknesses from 0.0035" to 0.375" are available.
Standard Panel Sizes: 18" x 12" (457mm x 305mm) and 18" x 24" (457mm x 610mm).
Standard Cladding Options: Choose from electrodeposited copper foil (½ oz or 1 oz) for general use, or rolled copper foil for applications demanding the lowest possible conductor loss at extremely high frequencies. Cladding with other metals (e.g., aluminum) or unclad material is also available.
Ideal Applications
For projects where signal integrity, loss minimization, and batch-to-batch consistency are non-negotiable, RT/duroid 5870 delivers proven performance. Contact our sales engineering team today to discuss your specific requirements, request samples, or place an order. We are here to provide the technical support and material solutions that ensure your high-frequency design succeeds.
| Cuota De Producción: | 1 Uds. |
| Precio: | 7.99 USD/PCS |
| Embalaje Estándar: | Embalaje |
| Período De Entrega: | 2-10 días hábiles |
| Método De Pago: | T/t, PayPal |
| Capacidad De Suministro: | 50000 piezas |
RT/duroid® 5870 Copper-Clad Laminate: Precision and Performance for Demanding High-Frequency Designs
As your trusted supplier, we are pleased to offer the exceptional RT/duroid® 5870, a premier high-frequency laminate from Rogers Corporation engineered for the most critical RF and microwave applications. This material represents the gold standard for designers who require a perfect balance of stable electrical properties, mechanical integrity, and superior processability in stripline and microstrip circuits.
![]()
Unmatched Electrical Consistency and Low Loss
The core advantage of RT/duroid 5870 lies in its construction. It is a glass microfiber-reinforced PTFE composite, where the randomly oriented microfibers create exceptional uniformity in the dielectric constant (Dk) across the entire panel. This results in highly predictable performance, batch after batch. The laminate features a stable dielectric constant of 2.33 ± 0.02 (at 10 GHz) and an exceptionally low dissipation factor (Df) of 0.0012 at the same frequency. This ultra-low loss characteristic ensures minimal signal attenuation, making it an ideal choice for sensitive, high-performance applications operating well into the Ku-band and beyond. Its thermal coefficient of Dk is a remarkably low -115 ppm/°C, guaranteeing stable electrical behavior across a wide operational temperature range (-50°C to +150°C).
| PROPERTY | TYPICAL VALUES | DIRECTION | UNITS[3] | CONDITION | TEST METHOD | |||
| RT/duroid 5870 | RT/duroid 5880 | |||||||
| [1]Dielectric Constant, εr Process | 2.33 2.33 ± 0.02 spec. |
2.2 2.20 ± 0.02 spec. |
Z Z |
N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
||
| [4]Dielectric Constant, εr Design | 2.33 | 2.2 | Z | N/A | 8 GHz - 40 GHz | Differential Phase Length Method |
||
| Dissipation Factor, tan δ | 0.0005 0.0012 |
0.0004 0.0009 |
Z Z |
N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650, 2.5.5.3 10 GHz IPC-TM-2.5.5.5 | ||
| Thermal Coefficient of εr | -115 | -125 | Z | ppm/°C | -50 - 150°C | IPC-TM-650, 2.5.5.5 | ||
| Volume Resistivity | 2 X 107 | 2 X 107 | Z | Mohm cm | C96/35/90 | ASTM D257 | ||
| Surface Resistivity | 2 X 107 | 3 X 107 | Z | Mohm | C/96/35/90 | ASTM D257 | ||
| Specific Heat | 0.96 (0.23) | 0.96 (0.23) | N/A | J/g/K (cal/g/C) |
N/A | Calculated | ||
| Test at 23 °C | Test at 100°C | Test at 23 °C | Test at 100°C | N/A | MPa (kpsi) | A | ASTM D638 | |
| Tensile Modulus | ||||||||
| 1300 (189) | 490 (71) | 1070 (156) | 450 (65) | X | ||||
| 1280 (185) | 430 (63) | 860 (125) | 380 (55) | Y | ||||
| ultimate stress | 50 (7.3) | 34 (4.8) | 29 (4.2) | 20 (2.9) | X | |||
| 42 (6.1) | 34 (4.8) | 27 (3.9) | 18 (2.6) | Y | ||||
| ultimate strain | 9.8 | 8.7 | 6.0 | 7.2 | X | % | ||
| 9.8 | 8.6 | 4.9 | 5.8 | Y | ||||
| Compressive Modulus | 1210 (176) | 680 (99) | 710 (103) | 500 (73) | X | MPa (kpsi) | A | ASTM D695 |
| 1360 (198) | 860 (125) | 710 (103) | 500 (73) | Y | ||||
| 803 (120) | 520 (76) | 940 (136) | 670 (97) | Z | ||||
| ultimate stress | 30 (4.4) | 23 (3.4) | 27 (3.9) | 22 (3.2) | X | |||
| 37 (5.3) | 25 (3.7) | 29 (5.3) | 21 (3.1) | Y | ||||
| 54 (7.8) | 37 (5.3) | 52 (7.5) | 43 (6.3) | Z | ||||
| ultimate strain | 4.0 | 4.3 | 8.5 | 8.4 | X | % | ||
| 3.3 | 3.3 | 7.7 | 7.8 | Y | ||||
| 8.7 | 8.5 | 12.5 | 17.6 | Z | ||||
| Moisture Absorption | 0.02 | 0.02 | N/A | % | .062” (1.6mm) | ASTM D570 | ||
| D48/50 | ||||||||
| Thermal Conductivity | 0.22 | 0.2 | Z | W/m/K | 80°C | ASTM C518 | ||
| Coefficient of Thermal Expansion |
22 | 31 | X | ppm/°C | 0-100°C | IPC-TM-650, 2.4.41 | ||
| 28 | 48 | Y | ||||||
| 173 | 237 | Z | ||||||
| Td | 500 | 500 | N/A | °CTGA | N/A | ASTM D3850 | ||
| Density | 2.2 | 2.2 | N/A | gm/cm3 | N/A | ASTM D792 | ||
| Copper Peel | 27.2 (4.8) | 31.2 (5.5) | N/A | pli (N/mm) | 1 oz (35mm) EDC | IPC-TM-650 2.4.8 | ||
| foil | ||||||||
| after solder float | ||||||||
| Flammability | V-0 | V-0 | N/A | N/A | N/A | UL94 | ||
| Lead-Free Process Compatible | Yes | Yes | N/A | N/A | N/A | N/A | ||
Robust Mechanical Properties for Reliable Fabrication
Beyond its electrical excellence, RT/duroid 5870 is designed for reliable manufacturing. It is easily machined, cut, and sheared without fraying, and exhibits excellent resistance to the solvents and reagents used in standard PCB etching and plating processes. With a very low moisture absorption of only 0.02%, it maintains dimensional and electrical stability in humid environments. The material provides strong copper peel strength (>4.8 pli for 1 oz EDC) for reliable plated through-holes and surface mounts, and it carries a UL 94 V-0 flammability rating, meeting stringent safety requirements. It is fully compatible with lead-free assembly processes.
Flexible Standard Configurations to Meet Your Needs
We supply RT/duroid 5870 in a variety of standard configurations for your design flexibility:
Standard Thicknesses: 0.005" (0.127mm), 0.010" (0.252mm), 0.020" (0.508mm), 0.031" (0.787mm), and 0.062" (1.575mm), all with tight tolerances. Numerous additional thicknesses from 0.0035" to 0.375" are available.
Standard Panel Sizes: 18" x 12" (457mm x 305mm) and 18" x 24" (457mm x 610mm).
Standard Cladding Options: Choose from electrodeposited copper foil (½ oz or 1 oz) for general use, or rolled copper foil for applications demanding the lowest possible conductor loss at extremely high frequencies. Cladding with other metals (e.g., aluminum) or unclad material is also available.
Ideal Applications
For projects where signal integrity, loss minimization, and batch-to-batch consistency are non-negotiable, RT/duroid 5870 delivers proven performance. Contact our sales engineering team today to discuss your specific requirements, request samples, or place an order. We are here to provide the technical support and material solutions that ensure your high-frequency design succeeds.