logo
productos
DETALLES DE LOS PRODUCTOS
En casa. > Productos >
TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold

Cuota De Producción: 1 por ciento
Precio: 7USD/PCS
Embalaje Estándar: Embalaje
Período De Entrega: 2-10 días hábiles
Método De Pago: T/t, PayPal
Capacidad De Suministro: 50000pcs
Información detallada
Lugar de origen
PORCELANA
Nombre de la marca
AGC
Certificación
ISO9001
Número de modelo
TSM-DS3 PCB
Cantidad de orden mínima:
1 por ciento
Precio:
7USD/PCS
Detalles de empaquetado:
Embalaje
Tiempo de entrega:
2-10 días hábiles
Condiciones de pago:
T/t, PayPal
Capacidad de la fuente:
50000pcs
Descripción del producto

What circuit boards do we do? (51)

TMS-DS3 High Frequency PCB

 

Introduction

TSM-DS3 is a dimensionally stable laminate with exceptional low-loss properties. Its thermal stability makes it an industry-leading choice, with a dissipation factor (DF) of 0.0011 at 10 GHz. This laminate offers the reliability and consistency of top-quality fiberglass reinforced epoxies.

 

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 0

 

Features

TSM-DS3 stands out as a ceramic-filled reinforced material with a minimal fiberglass content of approximately 5%. This composition allows it to compete with epoxies in the fabrication of complex multilayers, even in large formats. It was specifically developed for high-power applications, where efficient heat dissipation is crucial (thermal conductivity: 0.65 W/m*K). TSM-DS3 effectively conducts heat away from other heat sources in a PCB design.

 

Furthermore, TSM-DS3 exhibits very low coefficients of thermal expansion, making it suitable for demanding thermal cycling requirements.

 

 

PCB Capability

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 1

Our capabilities include single-sided, double-sided, multi-layer PCBs, as well as hybrid PCBs. You have the flexibility to choose the appropriate copper weight for your requirements, whether it's 1oz (35µm) or 2oz (70µm).

 

Additionally, we can accommodate various dielectric thicknesses, ranging from 5mil to 90mil, including options such as 10mil, 20mil, 30mil, 60mil and more.

 

Our capabilities extend to dimension sizes up to 400mm X 500mm, ensuring we can handle projects of different scales. To suit your aesthetic and functional preferences, we offer a diverse range of solder mask colors, including green, black, blue, yellow, red, and more.

 

Moreover, we provide various surface finish options including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold etc.

 

 

Applications

TSM-DS3 PCB covers a multitude of applications, including couplers, phased array antennas, radar manifolds, mmWave antennas, oil drilling, semiconductor, and automated test equipment (ATE) testing.

 

Thank you. I’ll see you next time.

productos
DETALLES DE LOS PRODUCTOS
TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold
Cuota De Producción: 1 por ciento
Precio: 7USD/PCS
Embalaje Estándar: Embalaje
Período De Entrega: 2-10 días hábiles
Método De Pago: T/t, PayPal
Capacidad De Suministro: 50000pcs
Información detallada
Lugar de origen
PORCELANA
Nombre de la marca
AGC
Certificación
ISO9001
Número de modelo
TSM-DS3 PCB
Cantidad de orden mínima:
1 por ciento
Precio:
7USD/PCS
Detalles de empaquetado:
Embalaje
Tiempo de entrega:
2-10 días hábiles
Condiciones de pago:
T/t, PayPal
Capacidad de la fuente:
50000pcs
Descripción del producto

What circuit boards do we do? (51)

TMS-DS3 High Frequency PCB

 

Introduction

TSM-DS3 is a dimensionally stable laminate with exceptional low-loss properties. Its thermal stability makes it an industry-leading choice, with a dissipation factor (DF) of 0.0011 at 10 GHz. This laminate offers the reliability and consistency of top-quality fiberglass reinforced epoxies.

 

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 0

 

Features

TSM-DS3 stands out as a ceramic-filled reinforced material with a minimal fiberglass content of approximately 5%. This composition allows it to compete with epoxies in the fabrication of complex multilayers, even in large formats. It was specifically developed for high-power applications, where efficient heat dissipation is crucial (thermal conductivity: 0.65 W/m*K). TSM-DS3 effectively conducts heat away from other heat sources in a PCB design.

 

Furthermore, TSM-DS3 exhibits very low coefficients of thermal expansion, making it suitable for demanding thermal cycling requirements.

 

 

PCB Capability

TMS-DS3 High Frequency PCB with HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold 1

Our capabilities include single-sided, double-sided, multi-layer PCBs, as well as hybrid PCBs. You have the flexibility to choose the appropriate copper weight for your requirements, whether it's 1oz (35µm) or 2oz (70µm).

 

Additionally, we can accommodate various dielectric thicknesses, ranging from 5mil to 90mil, including options such as 10mil, 20mil, 30mil, 60mil and more.

 

Our capabilities extend to dimension sizes up to 400mm X 500mm, ensuring we can handle projects of different scales. To suit your aesthetic and functional preferences, we offer a diverse range of solder mask colors, including green, black, blue, yellow, red, and more.

 

Moreover, we provide various surface finish options including immersion gold, HASL, immersion silver, immersion tin, ENEPIG, OSP, bare copper, and pure gold etc.

 

 

Applications

TSM-DS3 PCB covers a multitude of applications, including couplers, phased array antennas, radar manifolds, mmWave antennas, oil drilling, semiconductor, and automated test equipment (ATE) testing.

 

Thank you. I’ll see you next time.

Mapa del Sitio |  Política de privacidad | China es buena. Calidad PCB recién enviado por Bicheng Proveedor. Derecho de autor 2016-2025 Shenzhen Bicheng Electronics Technology Co., Ltd Todo. Todos los derechos reservados.